Chiplet
A design approach that splits a processor into several small silicon dies combined in one package instead of one large die.
// EXPLANATION
Small dies have a higher manufacturing yield, which lowers cost, and different sections can be built on different process technologies. In AMD's Zen architecture, core dies (CCDs) and a separate I/O die are linked with Infinity Fabric. The price is extra latency and energy for die-to-die communication.
// ALSO KNOWN AS
chipletchipletsmulti-die
// RELATED TERMS
Monolithic dieThe traditional processor design in which all functions sit on a single silicon die.
Zen architectureThe family of microarchitectures AMD introduced with Ryzen in 2017 that rebalanced the processor market through chiplet design and high IPC.
System on a chip (SoC)An integrated circuit that combines components such as the CPU, graphics unit, NPU, modem and memory controller on one piece of silicon.
Nanometre (process node)The name of a chip manufacturing technology (for example 3 nm, 2 nm); today it works more as a marketing label than a real length.
